Magnetic Solder to Wire 3-D Chips

A new type of solder can be melted and shaped in three dimensions under the force of a weak magnetic field. Using a magnet to pull the solder up through narrow holes makes it possible to create electrical connections between stacked silicon chips, for example. These three-dimensional chips pack more computing power in a given area, but making connections between them is expensive, a problem that the new solder might address. The solder also contains no lead, and it is stronger than other lead-free solders