Researchers from Intel and the University of California at Santa Barbara have found a way to build low-cost laser chips that could eventually shuttle data around PCs at much higher speeds than today’s copper wire interconnects. The researchers combined the properties of a compound semiconductor material called indium phosphide, which emits light constantly, and silicon, which can be used to amplify and direct that light. They sandwiched the materials together to create a single device that can be manufactured using standard chip-making techniques
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